LED screen heat is well done this summer without worry

The LED full-color display lamp housing heat dissipation will have different considerations depending on the power level and the place of use.

1. Air hydrodynamics, using the shape of the lamp housing to create convective air, which is a cost-enhancing way of cooling.

2. The heat-conductive plastic shell is filled with the heat-conducting material during the injection molding of the plastic shell to increase the heat conduction and heat-dissipating ability of the plastic shell.

3, aluminum heat sink fins, this is the * common heat dissipation method, using aluminum heat sink fins as part of the outer casing to increase the heat dissipation area.

4, surface radiation heat treatment, the surface of the lamp shell to do radiation heat treatment, the simple is to apply radiation heat sink paint, you can take the heat away from the surface of the lamp shell.

5, the heat pipe heat dissipation, using the heat pipe technology, the heat is led from the LED full color display chip to the shell heat sink fins. Large lamps, such as street lamps, are common designs.

6. The fan dissipates heat, and the inside of the lamp housing uses a long-life and high-efficiency fan to enhance heat dissipation. This method has low cost and good effect. However, it is troublesome to change the fan and it is not suitable for outdoor use. This design is rare.

7. Liquid bulbs, which use liquid bulb encapsulation technology to fill a transparent liquid with a high thermal conductivity into the bulb of the lamp body. This is the technology that uses the light-emitting surface of the LED chip to conduct heat and dissipate heat in addition to the principle of reflection.

8, heat conduction and heat dissipation integration - the use of high thermal conductivity ceramics, the purpose of heat dissipation of the lamp housing is to reduce the working temperature of the LED full color display chip, because the LED chip expansion coefficient and our common metal heat conduction, heat dissipation material expansion coefficient is very different The LED chip cannot be directly soldered to prevent the high and low temperature thermal stress from damaging the chip of the LED full color display. * New high thermal conductivity ceramic material, the thermal conductivity is close to aluminum, and the expansion system can be adjusted to synchronize with the LED full color display chip. In this way, heat conduction and heat dissipation can be integrated to reduce the intermediate process of heat conduction.